Integration Manual

GTM353W Integration Manual
Author:
R
. Claessens
Version:
4.0 Draft 2
Creation Date:
September 20, 2006
Page:
12 of 52
Option Confidential:
This document is Option Confidential - it may not be duplicated, neither distributed externally without prior and written permission of
Option NV.
3.3 UICC interface guidelines
3.3.1 Introduction
This section describes how to design the UICC (USIM)-card interface for connection with the
GTM.
The baseband processor has an integrated UICC interface compatible with the ISO7816 IC
card standard. This is wired to the PCIExpress Mini Card connector (PCIE connector) in
order to be connected to an external UICC card holder (see Figure 5: (U)SIM pin assignment).
Five pins on the PCIE connector are reserved for the (U)SIM interface (pins 8,10,12, 14 and
15 - see Table 1 and Table 3).
The (U)SIM interface of a GSM/GPRS/EDGE/UMTS/HSDPA module needs some special
requirements. The (U)SIM card is connected with the digital part of the module. An RF
interference signal picked-up by the (U)SIM card reader can disturb normal operation of the
module and result in unexpected errors.
The (U)SIM card is accessible by the customer. In many cases an efficient RF-shielding of the
(U)SIM card is not possible. However, with some precautions problems caused by
interference signals picked up by the (U)SIM card can be significantly reduced.
3.3.2 UICC Interface
3.3.2.1 UICC Card Holder
The UICC Card interface has got 6 contacts. Officially according to 3GPP there are 8 pads,
so you will find eight (8) pads on the PCB-Layout picture (
Figure 4) and in the specification
of the PCI Express Mini Card, numbered from C1 to C8. Contacting elements in positions C4
and C8 are not used. They shall present high impedance to the UICC. Figure 5 and Table 3
show the pin assignment of a UICC card.
However as a way of an example “how to connect” the company JAE has introduced
(http://www.jae-connector.com/) 6 pins UICC connectors. These are numbered JAE-1
through JAE-6. For convenience the JAE numbering is added on the PCB-Layout picture
(
Figure 4).
All the active circuitry is placed on the GTM. Only passives should be further applied.