Datasheet

Revision history STM32H743xI
228/231 DS12110 Rev 5
9 Revision history
Table 129. Document revision history
Date Revision Changes
22-Jun-2017 1 Initial release.
27-Sep-2017 2
Updated list of features. Changed datasheet status to
“production data”.
Added UFBGA169 and TFBGA100 packages and well as notes
related their status on cover page and in Table 2: STM32H743xI
features and peripheral counts. Differentiated number of GPIOs
for each package in Table 2: STM32H743xI features and
peripheral counts.
Updated Error code correction (ECC) in Section 3.3.2:
Embedded SRAM. Change PWR_CR3 into PWR_D3CR in
Section 3.5.1: Power supply scheme. Updated Section 3.12:
Nested vectored interrupt controller (NVIC).
Added ADC sampling rate values in Section 3.17: Analog-to-
digital converters (ADCs).
Added Table 4: DFSDM implementation in Section 3.23: Digital
filter for sigma-delta modulators (DFSDM)
Changed PC2/3 to PC2/3_C and VDD33USB to VDD in
Figure 4: LQFP100 pinout. Changed PC2/3 to PC2/3_C in
Figure 6: LQFP144 pinout. Changed PC2/3 to PC2/3_C in
Figure 8: LQFP176 pinout. Changed PC2/3 to PC2/3_C in
Figure 10: LQFP208 pinout.
Table 8: STM32H743xI pin/ball definition:
– Modified PA7, PC4, PC5, PB1, PG1, PE7, PE8 and PE9 I/O
structure
– TFBGA240 +25: removed duplicate occurrence of F1, F2 and
P17
pin; added notes related to F1, F2, G2 pin connection;
added note on E1, L16, L17, M16, M17, K16, K17, N17.
– UFBGA176+25: changed G10 pin name to VSS.
– Added note to VREF+ pin.
Added current consumption corresponding to 125 °C ambient
te
mperature in Section 6.3.6: Supply current characteristics.
Removed CRYP peripheral from Table 38: Peripheral current
consumption in Run mode.
Replaced FMC_CLK by FMC_SDCLK in Section : SDRAM
waveforms and timings.
Changed description of the last five f
S
values and updated
t
LATRINJ
in Table 85: ADC characteristics.
For TFBGA100, TFBGA240+25 and UFBGA169, updated
thermal resistance power-junction in Table 127: Thermal
characteristics as well as power dissipation in Table 23: General
operating conditions.