Datasheet

Package information STM32H743xI
226/231 DS12110 Rev 5
7.9 Thermal characteristics
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max × 
JA
)
Where:
 T
A
max is the maximum ambient temperature in C,

JA
is the package junction-to-ambient thermal resistance, in C/W,
 P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
 P
INT
max is the product of I
DD
and V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max represents the maximum power dissipation on output pins where:
P
I/O
max = (V
OL
× I
OL
) + ((V
DD
– V
OH
) × I
OH
),
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
7.9.1 Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 127. Thermal characteristics
Symbol Parameter Value Unit

JA
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm /0.5 mm pitch
45.0
°C/W
Thermal resistance junction-ambient
TFBGA100 - 8 x 8 mm /0.8 mm pitch
39.3
Thermal resistance junction-ambient
LQFP144 - 20 x 20 mm /0.5 mm pitch
43.7
Thermal resistance junction-ambient
UFBGA169 - 7 x 7 mm /0.5 mm pitch
37.7
Thermal resistance junction-ambient
LQFP176 - 24 x 24 mm /0.5 mm pitch
43.0
Thermal resistance junction-ambient
LQFP208 - 28 x 28 mm /0.5 mm pitch
42.4
Thermal resistance junction-ambient
UFBGA176+25 - 10 x 10 mm /0.65 mm pitch
37.4
Thermal resistance junction-ambient
TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch
36.6