Datasheet
DS12110 Rev 5 225/231
STM32H743xI Package information
227
Device marking for TFBGA240+25
The following figure gives an example of topside marking versus pin 1 position identifier
location.
Other optional marking or inset/up
set marks, which depend on supply chain operations, are
not indicated below.
Figure 86. TFBGA240+25 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
Table 126. TFBGA - 240+25ball recommended PCB design rules (0.8 mm pitch)
Dimension Recommended values
Pitch 0.8 mm
Dpad 0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.250 mm
Stencil thickness 0.100 mm
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