Datasheet
Package information STM32H743xI
206/231 DS12110 Rev 5
Device marking for TFBGA100
The following figure gives an example of topside marking versus pin 1 position identifier
location.
Other optional marking or inset/up
set marks, which depend on supply chain operations, are
not indicated below.
Figure 70. TFBGA100 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not approved for use in production. ST is not responsible for any consequences
resulting from such use. In no event will ST be liable for the customer using any of these engineering
samples in production. ST’s Quality department must be contacted prior to any decision to use these
engineering samples to run a qualification activity.
Table 118. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8
Dpad 0.400 mm
Dsm
0.470 mm typ (depends on the soldermask
registration tolerance)
Stencil opening 0.400 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
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