Datasheet

DS12110 Rev 5 205/231
STM32H743xI Package information
227
Figure 69. TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array
package recommended footprint
1. Dimensions are expressed in millimeters.
D 7.850 8.000 8.150 0.3091 0.3150 0.3209
D1 - 7.200 - 0.2835 -
E 7.850 8.000 8.150 0.3091 0.3150 0.3209
E1 - 7.200 - - 0.2835 -
e - 0.800 - - 0.0315 -
F - 0.400 - - 0.0157 -
G - 0.400 - - 0.0157 -
ddd - - 0.100 - - 0.0039
eee - - 0.150 - - 0.0059
fff - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 117. TFBGA100, 8 x 8 × 0.8 mm thin fine-pitch ball grid array
package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
'SDG
'VP