Data Sheet

24 Proprietary to OmniVision Technologies, Inc. Version 1.1, March 30, 2007
OV7725 Color CMOS VGA OmniPixel2™ CAMERACHIP™ Sensor
O
mni ision
Package Specifications
The OV7725 uses a 28-ball Chip Scale Package 2 (CSP2). Refer to Figure 12 for package information, Ta b le 7 for package
dimensions and Figure 13 for the array center on the chip.
Figure 12 OV7725-CSP2 Package Specifications
Note: For OVT devices that are lead-free, all part marking letters are
lower case. Underlining the last digit of the lot number indicates
CSP2 is used.
Table 7 OV7725-CSP2 Package Dimensions
Parameter Symbol Minimum Nominal Maximum Unit
Package body dimension X A 5320 5345 5370 µm
Package body dimension Y B 5240 5265 5290 µm
Package height C 845 905 965 µm
Ball height C1 150 180 210 µm
Package body thickness C2 680 725 770 µm
Cover glass thickness C3 375 400 425 µm
Airgap between cover glass and sensor C4 30 45 60 µm
Ball diameter D 320 350 380 µm
Total pin count N 28
Pin count X-axis N1 6
Pin count Y-axis N2 6
Pins pitch X-axis J1 800 µm
Pins pitch Y-axis J2 750 µm
Edge-to-pin center distance analog X S1 643 673 703 µm
Edge-to-pin center distance analog Y S2 728 758 788 µm
123456564321
A
B
C
D
E
F
A
A
B
C
D
E
F
J1
S1
center of BGA (die) =
center of the package
B
J2
C2
C1
glass die
CC4
C3
S2
350
bottom view
(bumps up)
top view
(bumps down)
side view
wxyz
abcd
note 1 part marking code:
w - OVT product version
x - year part was assembled
y - month part was assembled
z - wafer number
abcd - last four digits of lot number
chip center
optical center
7725CSP_DS_01
2