Data Sheet

TPS731
SBVS034N –SEPTEMBER 2003–REVISED DECEMBER 2015 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
IN
–0.3 6
V
EN
–0.3 6
Voltage V
V
OUT
–0.3 5.5
V
NR
, V
FB
–0.3 6
Peak output current I
OUT
Internally limited
Output short-circuit duration Indefinite
Continuous total power
P
DISS
See Power Dissipation
dissipation
Junction, T
J
–55 150
Temperature °C
Storage, T
stg
–65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
±2000
pins
(1)
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-
±500
C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
IN
Input supply voltage range 1.7 5.5 V
I
OUT
Output current 0 150 mA
T
J
Operating junction temperature –40 125 °C
6.4 Thermal Information
TPS731xx
THERMAL METRIC
(1)
DBV (SOT-23) UNIT
5 PINS
R
θJA
Junction-to-ambient thermal resistance 207.2
R
θJC(top)
Junction-to-case (top) thermal resistance 124.2
R
θJB
Junction-to-board thermal resistance 35 °C/W
ψ
JT
Junction-to-top characterization parameter 13.5
ψ
JB
Junction-to-board characterization parameter 34.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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