Data Sheet

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PN2907 / MMBT2907 — PNP General-Purpose Transistor

Publication Order Number:

PN2907/D

October-2017, Rev. 2

PN2907 / MMBT2907

PNP General-Purpose Transistor

Ordering Information

Part Number Top Mark Package Packing Method

PN2907BU PN2907 TO-92 3L Bulk

MMBT29070-D87Z

2B SOT-23 3L Tape and Reel

PN2907

MMBT2907

EBC

TO-92 SOT-23

Mark:2B

Description

This device is designed for use with general-purpose

amplifiers and switches requiring collector currents to

500 mA. Sourced from process 63.

Summary of content (6 pages)

PAGE 1
PN2907 / MMBT2907 — PNP General-Purpose Transistor PN2907 / MMBT2907 PNP General-Purpose Transistor Description This device is designed for use with general-purpose amplifiers and switches requiring collector currents to 500 mA. Sourced from process 63. PN2907 MMBT2907 C E TO-92 SOT-23 Mark:2B EBC B Ordering Information Part Number Top Mark Package Packing Method PN2907BU PN2907 TO-92 3L Bulk MMBT29070-D87Z 2B SOT-23 3L Tape and Reel © 1997 Semiconductor Components Industries, LLC.
PAGE 2
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
PAGE 3
Values are at TA = 25°C unless otherwise noted. Symbol Parameter Conditions Min. Max. Unit Off Characteristics V(BR)CEO Collector-Emitter Breakdown Voltage(5) IC = -10 mA, IB = 0 IC = -10 μA, IE = 0 V(BR)CBO Collector-Base Breakdown Voltage -40 V -60 V Emitter-Base Breakdown Voltage IE = -10 μA, IC = 0 -5.0 V Collector Cut-Off Current VCE = -30 V, VEB = -0.5 V -50 nA Base Cut-Off Current VCE = -30 V, VEB = -0.
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PN2907 / MMBT2907 — PNP General-Purpose Transistor Physical Dimensions TO-92 (Bulk) D Figure 1. 3-LEAD, TO92, JEDEC TO-92 COMPLIANT STRAIGHT LEAD CONFIGURATION (OLD TO92AM3) Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision.
PAGE 5
SOT-23 0.95 2.92±0.20 3 1.40 1.30+0.20 -0.15 1 2.20 2 0.60 0.37 (0.29) 0.95 0.20 1.00 A B 1.90 1.90 LAND PATTERN RECOMMENDATION SEE DETAIL A 1.20 MAX 0.10 0.00 (0.93) 0.10 C C 2.40±0.30 NOTES: UNLESS OTHERWISE SPECIFIED GAGE PLANE 0.23 0.08 0.25 0.20 MIN (0.55) SEATING PLANE A) REFERENCE JEDEC REGISTRATION TO-236, VARIATION AB, ISSUE H. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE INCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR EXTRUSIONS.
PAGE 6
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