Datasheet

NCP1421
http://onsemi.com
13
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE F
8X
8X
6X

mm
inches

SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
S
B
M
0.08 (0.003) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C −−− 1.10 −−− 0.043
D 0.25 0.40 0.010 0.016
G 0.65 BSC 0.026 BSC
H 0.05 0.15 0.002 0.006
J 0.13 0.23 0.005 0.009
K 4.75 5.05 0.187 0.199
L 0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
−B−
−A−
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
C
H
J
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*