Datasheet

NCL30160
http://onsemi.com
3
MAXIMUM RATINGS
Rating Symbol Min Max Unit
VIN to GND VIN −0.3 40 V
MOSFET Drain Voltage to GND LX − 40 V
VCC to GND VCC − 6 V
DIM/EN to GND DIM −0.3 6 V
CS to GND CS −0.3 6 V
ROT to GND ROT −0.3 6 V
Absolute Maximum Junction Temperature T
J
(MAX)
150 °C
Operating Junction Temperature Range T
J
−40 125 °C
Maximum LED Drive Current ILIM 1.5 A
Storage Temperature Range T
stg
−55 to +125 °C
Thermal Characteristics
SOIC−8 Plastic Package
Maximum Power Dissipation @ T
A
= 25°C (Note 1)
Thermal Resistance Junction−to−Air (Note 2)
PD
R
q
JA
1.11
111.7
W
°C/W
Lead Temperature Soldering (10 sec):
Re−flow (SMD styles only) Pb−Free (Note 3)
T
L
260 peak °C
Moisture Sensitivity Level (Note 4) MSL 1 −
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
P
D
+
T
J(max)
* T
A
R
qJA
2. When mounted on a multi−layer board with 35 mm
2
copper area, using 1 oz Cu.
3. 60−180 seconds minimum above 237°C.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.