Data Sheet

MOCD207M, MOCD208M, MOCD211M, MOCD213M, MOCD217M
www.onsemi.com
6
SWITCHING TIME TEST CIRCUIT AND WAVEFORMS
Figure 7. Switching Time Test Circuit and Waveforms
OUTPUT PULSE
INPUT PULSE
t
r
t
f
INPUT
I
F
R
L
R
BE
V
CC
= 10 V
OUTPUT
t
on
10%
90%
t
off
I
C
Adjust
I
F to produce
I
C = 2 mA
REFLOW PROFILE
Figure 8. Reflow Profile
Time (seconds)
Temperature (_C)
Time 25°C to Peak
260
240
220
200
180
160
140
120
100
80
60
40
20
0
T
L
t
s
t
L
t
P
T
P
Tsmax
Tsmin
120
Preheat Area
Max. Ramp−up Rate = 3°C/S
Max. Ramp−down Rate = 6°C/S
240 360
Profile Feature Pb−Free Assembly Profile
Temperature Minimum (Tsmin) 150°C
Temperature Maximum (Tsmax) 200°C
Time (t
S
) from (Tsmin to Tsmax) 60 − 120 seconds
Ramp−up Rate (t
L
to t
P
) 3°C/second maximum
Liquidous Temperature (T
L
) 217°C
Time (t
L
) Maintained Above (T
L
) 60 − 150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (t
P
) within 5°C of 260°C 30 seconds
Ramp−down Rate (T
P
to T
L
) 6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum