Data Sheet

MOC3051M, MOC3052M, MOC3053M
REFLOW PROFILE
Profile
Feature
Temperature Minimum (Tsmin)
Temperature
Maximum (Tsmax)
Time (t
S
) from (Tsmin to Tsmax)
Ramp-up Rate (T
L
to T
Liquidous Temperature (T
Time (t
L
) Maintained Above (T
Peak Body Package Temperature
Time (t
P
) within 5°C of 260°C
Ramp-down Rate (T
P
Time 25°C to Peak Temperature
MOC3051M, MOC3052M, MOC3053M
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8
Feature
Pb-Free Assembly Profile
Temperature Minimum (Tsmin)
150°C
Maximum (Tsmax)
200°C
) from (Tsmin to Tsmax)
60 seconds to 120 seconds
to T
P
)
3°C/second maximum
Liquidous Temperature (T
L
)
217°C
) Maintained Above (T
L
)
60 seconds to 150 seconds
Peak Body Package Temperature
260°C +0°C / –5°C
) within 5°C of 260°C
30 seconds
P
to T
L
)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
Figure 11. Reflow Profile