Datasheet

ManualsBrandsON Semiconductor ManualsDiodesZener Diode 500mW 3.3V 5uA SOD-123

 Semiconductor Components Industries, LLC, 2012

January, 2012 − Rev. 11

1 Publication Order Number:

MMSZ2V4T1/D

MMSZxxxT1G Series,

SZMMSZxxxT1G Series

Zener Voltage Regulators

500 mW SOD−123 Surface Mount

Three complete series of Zener diodes are offered in the convenient,

surface mount plastic SOD−123 package. These devices provide a

convenient alternative to the leadless 34−package style.

Features

 500 mW Rating on FR−4 or FR−5 Board

 Wide Zener Reverse Voltage Range − 2.4 V to 56 V

 Package Designed for Optimal Automated Board Assembly

 Small Package Size for High Density Applications

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 AEC−Q101 Qualified and PPAP Capable

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

 Pb−Free Packages are Available*

Mechanical Characteristics

CASE:

Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily Solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

MAXIMUM RATINGS

Rating Symbol Max Unit

Total Power Dissipation on FR−5 Board,

(Note 1) @ T

= 75C

Derated above 75C

500

6.7

mW/C

Thermal Resistance, Junction−to−Ambient

(Note 2)

340 C/W

Thermal Resistance, Junction−to−Lead

(Note 2)

150 C/W

Junction and Storage Temperature Range T

, T

stg

−55 to +150 C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 3.5 X 1.5 inches.

2. Thermal Resistance measurement obtained via infrared Scan Method.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping

†

ORDERING INFORMATION

SOD−123

CASE 425

STYLE 1

Cathode

Anode

MARKING DIAGRAM

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

DEVICE MARKING INFORMATION

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MMSZxxxT1G SOD−123

(Pb−Free)

3,000 /

Tape & Reel

xx M G

xx = Device Code

M = Date Code

G = Pb−Free Package

MMSZxxxT3G SOD−123

(Pb−Free)

10,000 /

Tape & Reel

(Note: Microdot may be in either location)

SZMMSZxxxT1G SOD−123

(Pb−Free)

3,000 /

Tape & Reel

SZMMSZxxxT3G SOD−123

(Pb−Free)

10,000 /

Tape & Reel

Summary of content (6 pages)

PAGE 1
MMSZxxxT1G Series, SZMMSZxxxT1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. http://onsemi.com Features         500 mW Rating on FR−4 or FR−5 Board Wide Zener Reverse Voltage Range − 2.
PAGE 2
MMSZxxxT1G Series, SZMMSZxxxT1G Series ELECTRICAL CHARACTERISTICS (TA = 25C unless I otherwise noted, VF = 0.95 V Max. @ IF = 10 mA) Symbol IF Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF VZ VR V IR VF IZT Zener Voltage Regulator ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max.
PAGE 3
MMSZxxxT1G Series, SZMMSZxxxT1G Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA) VZ1 (Volts) (Notes 6 and 7) ZZT1 (Note 8) @ IZT1 = 2 mA VZ2 (Volts) (Notes 6 and 7) ZZT2 (Note 8) Max Reverse Leakage Current @ IZT2 = 0.1 mA @ IZT2 = 0.5 mA IR @ VR Device Marking Min Nom Max W Min Max W mA Volts MMSZ27T1G/T3G Y1 25.65 27 28.35 80 25 28.9 300 0.05 18.9 MMSZ30T1G Y2 28.50 30 31.50 80 27.8 32 300 0.05 21 MMSZ33T1G Y3 31.
PAGE 4
MMSZxxxT1G Series, SZMMSZxxxT1G Series 8 7  VZ, TEMPERATURE COEFFICIENT (mV/C)  VZ, TEMPERATURE COEFFICIENT (mV/C) TYPICAL CHARACTERISTICS TYPICAL TC VALUES FOR MMSZxxxT1G SERIES, SZMMSZxxxT1G SERIES 6 5 4 VZ @ IZT 3 2 1 0 −1 −2 −3 2 3 4 5 6 7 8 9 10 11 VZ @ IZT 10 10 100 VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V) Figure 1. Temperature Coefficients (Temperature Range − 55C to +150C) Figure 2.
PAGE 5
MMSZxxxT1G Series, SZMMSZxxxT1G Series TYPICAL CHARACTERISTICS 1000 1000 0 V BIAS I R , LEAKAGE CURRENT ( A) TA = 25C C, CAPACITANCE (pF) 1 V BIAS 100 BIAS AT 50% OF VZ NOM 10 100 10 1 +150C 0.1 0.01 + 25C 0.001 − 55C 0.0001 1 1 100 10 0.00001 0 10 20 30 40 50 60 VZ, NOMINAL ZENER VOLTAGE (V) Figure 7. Typical Capacitance Figure 8. Typical Leakage Current TA = 25C I Z , ZENER CURRENT (mA) TA = 25C I Z , ZENER CURRENT (mA) 80 100 100 10 1 0.1 0.
PAGE 6
MMSZxxxT1G Series, SZMMSZxxxT1G Series PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE G D ÂÂÂÂ ÂÂÂÂ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L q E 2 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0 INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10  STYLE 1: PIN 1. CATHODE 2. ANODE q L b MILLIMETERS MIN NOM MAX 0.94 1.17 1.35 0.00 0.05 0.10 0.51 0.61 0.