Data Sheet

FFB3904 / FMB3904 / MMPQ3904 — NPN Multi-Chip General Purpose Amplifier
© 1998 Fairchild Semiconductor Corporation www.fairchildsemi.com
FFB3904 / FMB3904 / MMPQ3904 Rev. 1.1.1 9
Physical Dimensions (Continued)
Figure 27. 16-LEAD, SOIC, JEDEC MS-012, 0.150 inch, NARROW BODY (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/M1/M16A.pdf
.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-M16A.pdf
.
X 45°
DETAIL A
SCALE: 2:1
8°
0°
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AC, ISSUE C.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD
FLASH AND TIE BAR PROTRUSIONS
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P600X175-16AM
F) DRAWING FILE NAME: M16AREV12.
SEATING PLANE
GAGE PLANE
C
C0.10
SEE DETAIL A
LAND PATTERN RECOMMENDATION
PIN ONE
INDICATOR
1
16
8
M
0.25
9
CBA
B
A
5.6
1.27
0.65
1.75
10.00
9.80
8.89
6.00
1.27
(0.30)
0.51
0.35
1.75 MAX
1.50
1.25
0.25
0.10
0.25
0.19
(1.04)
0.90
0.50
0.36
(R0.10)
(R0.10)
0.50
0.25
4.00
3.80
SO 16L NB