Datasheet

TL7757, TL7757Y
SUPPLY VOLTAGE SUPERVISOR
AND PRECISION VOLTAGE DETECTOR
SLVS041D – SEPTEMBER 1991 – REVISED AUGUST 1995
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
GND
V
CC
RESET
LP PACKAGE
(TOP VIEW)
NC–No internal connection
1
2
3
4
8
7
6
5
RESET
V
CC
NC
GND
NC
NC
NC
NC
D PACKAGE
(TOP VIEW)
PK PACKAGE
(TOP VIEW)
GND is in electrical contact with the tab.
V
CC
RESETGND
TL7757Y chip information
This chip, when properly assembled, displays characteristics similar to the TL7757C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 11 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max= 150°C
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS
NO BACKSIDE METALIZATION
_
+
Reference
Voltage
V
CC
RESET
GND
†
†
Backside of chip has an internal electrical
connection to pad 4.
41
51
(3)
(1)
(2)
(1)
(3)
(2)