Datasheet

LM317L, NCV317LB
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Input-Output Voltage Differential V
I
-V
O
40 Vdc
Power Dissipation
Case 29 (TO-92)
T
A
= 25°C
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
Case 751 (SOIC-8) (Note 1)
T
A
= 25°C
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
P
D
R
q
JA
R
q
JC
P
D
R
q
JA
R
q
JC
Internally Limited
160
83
Internally Limited
180
45
W
°C/W
°C/W
W
°C/W
°C/W
Operating Junction Temperature Range T
J
-40 to +150 °C
Storage Temperature Range T
stg
-65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. SOIC-8 Junction-to-Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance
variation versus pad size.
2. This device series contains ESD protection and exceeds the following tests:
Human Body Model, 2000 V per MIL STD 883, Method 3015.
Machine Model Method, 200 V.
18k
6.8V
6.8V
350
300
300 300 3.0k
300
70
200k
2.560
50
130
8.67k
500
400
2.4k
12.8k
V
out
5.1k
6.3V
2.0k
6.0k
Adjust
V
in
180 180
10
p
F
10
p
F
Figure 1. Representative Schematic Diagram