Data Sheet

KA3842B/KA3843B/KA3844B/KA3845B
2
Absolute Maximum Ratings
Note:
1. Board Thickness 1.6mm, Board Dimension 76.2mm ×114.3mm, (Reference EIA / JSED51-3, 51-7)
2. Do not exceeed P
D
and SOA (Safe Operation Area)
Power Dissipation Curve
Thermal Data
Pin Array
Parameter Symbol Value Unit
Supply Voltage V
CC
30 V
Output Current I
O
±1A
Analog Inputs (Pin 2.3) V
(ANA)
-0.3 to 6.3 V
Error Amp Output Sink Current I
SINK (E.A)
10 mA
Power Dissipation at T
A
≤25°C (8DIP) P
D
(Note1,2) 1200 mW
Power Dissipation at T
A
≤25°C (14SOP) P
D
(Note1,2) 680 mW
Storage Temperature Range T
STG
-65 ~ +150 °C
Lead Temperature (Soldering, 10sec) T
LEAD
+300 °C
Characteristic Symbol 8-DIP 14-SOP Unit
Thermal Resistance Junction-ambient R
thj-amb(MAX)
100 180 °C/W
800
700
600
500
400
300
900
1000
1100
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
AMBIENT TEMPERATURE (℃)
POWER DISSIPATION (mW)
1200
8DIP
14SOP
800
700
600
500
400
300
900
1000
1100
0 102030405030 40 50 60 70 8060 70 80 90 100 11090 100 110 120 130 140120 130 140 150
AMBIENT TEMPERATURE (℃)
POWER DISSIPATION (mW)
1200
8DIP
14SOP
V
CC
GND
PWR GND
COMP
1
N/C 2
V
FB
N/C
3
4
V
REF
N/C
PWR VC
14
13
12
11
CURRENT SENSE 5
N/C
R
T/
C
T
6
7
OUTPUT
10
9
8
COMP
1
V
FB
2
CURRENT SENSE
R
T/
C
T
3
4
V
REF
V
CC
OUTPUT
GND
8
7
6
5
8DIP,8SOP
14SOP
V
CC
GND
PWR GND
COMP
1
N/C 2
V
FB
N/C
3
4
V
REF
N/C
PWR VC
14
13
12
11
CURRENT SENSE 5
N/C
R
T/
C
T
6
7
OUTPUT
10
9
8
V
CC
GND
PWR GND
COMP
1
N/C 2
V
FB
N/C
3
4
V
REF
N/C
PWR VC
14
13
12
11
CURRENT SENSE 5
N/C
R
T/
C
T
6
7
OUTPUT
10
9
8
COMP
1
V
FB
2
CURRENT SENSE
R
T/
C
T
3
4
V
REF
V
CC
OUTPUT
GND
8
7
6
5
COMP
1
V
FB
2
CURRENT SENSE
R
T/
C
T
3
4
V
REF
V
CC
OUTPUT
GND
8
7
6
5
8DIP,8SOP
14SOP
8-DIP