Data Sheet

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FT3001 • Rev. 1.0.4 9
FT3001 — Reset Timer with Configurable Delay
Physical Dimensions (Continued)
BOTTOM VIEW
SIDE VIEW
TOP VIEW
NOTES:
A. PACKAGE CONFORMS TO JEDEC MO-229,
VARIATION W2020D EXCEPT WHERE NOTED.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION BASED
ON PCB MATRIX CALCULATOR V2009.
E. IF CENTER PAD IS NOT SOLDERED TO, NO
EXPOSED METAL IS ALLOWED IN THE TOP
LAYER OF THE BOARD IN THE AREA SHOWN.
F. DRAWING FILENAME: MKT-MLP08Rrev2.
0.05
0.00
0.80 MAX
0.10
C
0.08
C
(0.20)
C
SEATING
PLANE
PIN1
IDENT
2.00
2.00
A
B
2X
2X
0.10 C
0.10 C
8
5
1
4
0.10 CAB
0.05
C
PIN 1
IDENT
0.50
0.65
0.45
0.25
0.15
8X
8X
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
OPTION #1: NO CENTER PAD
(0.25)
(0.90)
1.80
0.50
8X
8X
OPTION #2: WITH CENTER PAD
E
TOP LAYER
CU KEEP
OUT AREA
0.90
(1.35)
A
(0.25)
(0.90)
1.80
0.50
8X
8X
0.90
(0.35)
1.35 MAX
0.40 MAX
Figure 11. 8-Lead, Molded Leadless Package (MLP), Dual JEDEC, MO-229 2.0 x 2.0 mm
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
.