Data Sheet

© 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSUSB31 — Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps) Switch
FSUSB31 Rev. 1.1.0 13
Physical Dimensions (Continued)
Figure 24. 8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm
For MicroPak™ tape and reel specifications, please visit Fairchild’s website:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf
.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
.
1.20
1.4
5
2
0.35
0.25
7X
(0.2)
0.15
0.25
SEATING
PLANE
0.40
0.10 C A B
0.05 C
2X
2X
0.025
0.00
C
0.10
A
C
0.10
A. DOES NOT CONFORMS TO JEDEC STANDARD.
C
0.05
B
C
0.05
PIN#1 IDENT
0.55 MAX
C
BOTTOM VIEW
TOP VIEW
8
1
6
4
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES CONFORMS TO ASME Y14.5M, 1994.
D. DRAWING FILE NAME : UMLP08Arev1
8X
DETAIL A
DETAIL: A
SCALE : 2x
0.30
0.20
0.10
45°
0.10
0.400
0.250 8X
0.350 7X
0.450
1.250
0.625
1.450
0.725