Data Sheet

© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSL136MR • Rev. 1.0.7 4
FSL136MR — Green Mode Fairchild Power Switch (FPS™)
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only. T
J
= 25°C, unless otherwise specified.
Symbol Parameter Min. Max. Unit
V
STR
V
STR
Pin Voltage -0.3 650.0 V
V
DS
Drain Pin Voltage -0.3 650.0 V
V
CC
Supply Voltage 26 V
V
FB
Feedback Voltage Range -0.3 12.0 V
I
D
Continuous Drain Current 3 A
I
DM
Drain Current Pulsed
(4)
12 A
E
AS
Single Pulsed Avalanche Energy
(5)
230 mJ
P
D
Total Power Dissipation 1.5 W
T
J
Operating Junction Temperature Internally Limited °C
T
A
Operating Ambient Temperature -40 +105 °C
T
STG
Storage Temperature -55 +150 °C
ESD
Human Body Model, JESD22-A114
(6)
5.0
KV
Charged Device Model, JESD22-C101
(6)
1.5
Θ
JA
Junction-to-Ambient Thermal Resistance
(7,8)
80 °C/W
Θ
JC
Junction-to-Case Thermal Resistance
(7,9)
19 °C/W
Θ
JT
Junction-to-Top Thermal Resistance
(7,10)
33.7 °C/W
Notes:
4. Repetitive rating: pulse width limited by maximum junction temperature.
5. L=51mH, starting T
J
=25°C.
6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101.
7. All items are tested with the standards JESD 51-2 and JESD 51-10.
8. Θ
JA
free-standing, with no heat-sink, under natural convection.
9. Θ
JC
junction-to-lead thermal characteristics under Θ
JA
test condition. T
C
is measured on the source #7 pin closed
to plastic interface for Θ
JA
thermo-couple mounted on soldering.
10. Θ
JT
junction-to-top of thermal characteristic under Θ
JA
test condition. T
t
is measured on top of package. Thermo-
couple is mounted in epoxy glue.