Data Sheet

www.onsemi.com
4
FSL106HR Green Mode Power Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device r eliability.
The absolute maximum ratings are stress ratings only. T
J
= 25°C, unless otherw ise specified.
Symbol
Parameter
Min.
Max.
Unit
V
STR
V
STR
Pin Voltage
-0.3
650.0
V
V
DS
Drain Pin Voltage
-0.3
650.0
V
V
CC
Supply Voltage
26
V
V
FB
Feedback Voltage Range
-0.3
12.0
V
I
D
Continuous Drain Current
0.7
A
I
DM
Drain Current Pulsed
(
4
)
2.8
A
E
AS
Single Pulsed Avalanche Energy
(
5
)
15
mJ
P
D
Total Pow er Dissipation
1.5
W
T
J
Operating Junction Temperature
Internally Limited
°C
T
A
Operating Ambient Temperature
-40
+105
°C
T
STG
Storage Temperature
-55
+150
°C
ESD
Human Body Model, JESD22-A114
(
6
)
5
KV
Charged Device Model, JESD22-C101
(
6
)
2
JA
Junction-to-Ambient Thermal Resistance
(
7
,
8
)
80
°C/W
JC
Junction-to-Case Thermal Resistance
(
7
,
9
)
19
°C/W
JT
Junction-to-Top Thermal Resistance
(
7
,10)
33.7
°C/W
Notes:
4. Repetitive rating: pulse w idth limited by maximum junction temperature.
5. L=30mH, starting T
J
=25°C.
6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101.
7. All items are tested w ith the standards JESD 51-2 and JESD 51-10.
8.
JA
free-standing, w ith no heat-sink, under natural convection.
9.
JC
junction-to-lead thermal characteristics under
JA
test condition. T
C
is measured on the source #7 pin closed
to plastic interface for
JA
thermo-couple mounted on soldering.
10.
JT
junction-to-top of thermal characteristic under
JA
test condition. T
t
is measured on top of package. Thermo-
couple is mounted in epoxy glue.