Data Sheet

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10
FSA2567 — Low-Power, Dual SIM Card Analog Switch
Physical Dimensions
RECOMMENDED
LAND PATTERN
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
E. DRAWING FILENAME: MKT-UMLP16Arev5.
F. TERMINAL SHAPE MAY VARY ACCORDING
TO PACKAGE SUPPLIER, SEE TERMINAL
SHAPE VARIANTS.
PIN#1 IDENT
PIN#1 IDENT
TOP VIEW
BOTTOM VIEW
0.05
C
0.08
C
2.60
1.80
0.05
C
2X
2X
SIDE VIEW
0.10
C
0.025±0.025
0.10
C A B
0.05
C
0.50±0.05
0.40
1
5
9
13
16
2.10
2.90
0.40
0.663
0.563
0.225
1
(15X)
(16X)
0.15±0.05
A
B
C
SEATING
PLANE
0.40±0.05 (15X)
0.20±0.05 (16X)
1.80±0.05
2.60±0.05
DETAIL A
SCALE : 2X
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
R0.20
LEAD SHAPE AT PACKAGE EDGE
PACKAGE
EDGE
0.50±0.05
DETAIL A
SCALE : 2X
0.20±0.05
45°
Figure 21. 16-Lead Ultrathin Molded Leadless Package (UMLP)