Data Sheet
© 2006 Fairchild Semiconductor Corporation    www.fairchildsemi.com 
FSA2367 • Rev. 1.0.2  12 
 FSA2367 Low R
ON
 (0.75) Triple-SPDT, Negative-Swing Audio Source Switch 
Physical Dimensions (Continued) 
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
 AND TIE BAR EXTRUSIONS
F. DRAWING FILE NAME: MTC14REV6
R0.09 min
12.00°
TOP & BOTTOM
0.43 TYP
1.00
D. DIMENSIONING AND TOLERANCES PER ANSI
 Y14.5M, 1982
R0.09min
E. LANDPATTERN STANDARD: SOP65P640X110-14M
0.65
6.10
1.65
0.45
A. CONFORMS TO JEDEC REGISTRATION MO-153, 
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
Figure 22.  4-Lead Thin Shrink Small Outline Package (TSSOP) 
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: 
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