Data Sheet
November 2014
© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF3040 • Rev. 2.4.3
FPF3040 — IntelliMAX™ 18 V-Rated Dual Input Single Output Power-Source-Selector Switch
FPF3040
IntelliMAX™ 18 V-Rated Dual Input Single Output
Power-Source-Selector Switch
Features
Dual-Input, Single-Output Load Switch
Input Supply Operating Range:
- 4~10.5 V at V
IN
- 4~6.5 V at V
BUS
Typical R
ON
:
- 95 mΩ at V
IN
=5 V
- 70 mΩ at V
BUS
=5 V
Bi-Directional Switch for V
IN
and V
BUS
Slew Rate Controlled:
- 50 µs at V
IN
for < 4.7 µF C
OUT
- 90 µs at V
BUS
for < 4.7 µF C
OUT
Maximum I
SW
: 2 A Per Channel
Break-Before-Make Transition
Under-Voltage Lockout (UVLO)
Over-Voltage Lockout (OVLO)
Thermal Shutdown
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ESD Protected:
- Human Body Model: >3 kV
- Charged Device Model: >1.5 kV
- IEC 61000-4-2 Air Discharge: >15 kV
- IEC61000-4-2 Contact Discharge: >8 kV
Description
The FPF3040 is a 18 V-rated Dual-Input Single-Output
(DISO) load switch consisting of two channels of slew-
rate-controlled, low-on-resistance, N-channel MOSFET
switches with protection features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the input
power rails. The input voltage range operates from
4 V to 6.5 V at V
BUS
and from 4 V to 10.5 V at V
IN
to
align with the needs of low-voltage portable device
power rails.
V
IN
and V
BUS
have the over-voltage protection
functionality of typical 12 V and 7.5 V, respectively, to
avoid unwanted damage to system.
V
IN
and V
BUS
bi-directional switching allows reverse
current from V
OUT
to V
IN
or V
BUS
for On-The-Go, (OTG)
Mode. The switching is controlled by logic input EN and
V
IN_SEL
is capable of interfacing directly with low-voltage
control signal General-Purpose Input / Output (GPIO).
FPF3040 is available in 1.8 mm x 2.0 mm Wafer-Level
Chip-Scale Package (WLCSP), 16-bump, 0.4 mm pitch.
Applications
Input Power Selection Block Supporting USB and
Wireless Charging
Smartphone / Tablet PC
Ordering Information
Part Number
Top
Mark
Channel
Typical R
ON
per
Channel at 5V
IN
Rise Time (t
R
)
Package
FPF3040UCX
QY
DISO
95 mΩ for V
IN
50 µs for V
IN
1.8 mm x 2.0 mm Wafer-Level Chip-Scale
Package (WLCSP), 16-Bump, 0.4 mm Pitch
70 mΩ for V
BUS
90 µs for V
BUS