Data Sheet

©2004 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD2741A, FOD2741B, FOD2741C Rev. 1.0.1
1
3
FOD2741A, FOD2741B, FOD2741C — Optically Isolated Error Amplifier
Carrier Tape Specifications
Reflow Profile
Symbol Description Dimension in mm
WTape Width 16.0 ± 0.3
tTape Thickness 0.30 ± 0.05
P
0
Sprocket Hole Pitch 4.0 ± 0.1
D
0
Sprocket Hole Diameter 1.55 ± 0.05
E Sprocket Hole Location 1.75 ± 0.10
FPocket Location 7.5 ± 0.1
P
2
4.0 ± 0.1
PPocket Pitch 12.0 ± 0.1
A
0
Pocket Dimensions 10.30 ±0.20
B
0
10.30 ±0.20
K
0
4.90 ±0.20
W
1
Cover Tape Width 1.6 ± 0.1
dCover Tape Thickness 0.1 max
Max. Component Rotation or Tilt 10°
R Min. Bending Radius 30
d
0
P
t
2
D
0
1
1
W
User Direction of Feed
0
K
B
0
A
0
W
E
D
F
P
P
• Peak reflow temperature: 260 C (package surface temperature)
• Time of temperature higher than 183 C for 160 seconds or less
• One time soldering reflow is recommended
245 C, 10–30 s
Time (M
inute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Temperature (°C)
Time above 183 C, <160 sec
Ramp up = 2–10
C/sec
260
C peak