Data Sheet

FDC6306P
FDC6306P Rev. C
Typical Characteristics (continued)
Figure 7. Gate-Charge Characteristics. Figure 8. Capacitance Characteristics.
Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum
Power Dissipation.
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient themal response will change depending on the circuit board design.
0.1 0.2 0.5 1 2 5 10 20 50
0.01
0.03
0.1
0.3
1
3
10
30
-V , DRAIN-SOURCE VOLTAGE (V)
-I , DRAIN CURRENT (A)
RDS(ON) LIMIT
D
DS
V = -4.5V
SINGLE PULSE
R = 180°C/W
T = 25°C
θ
JA
GS
A
DC
1s
100ms
10ms
1ms
100us
0.01 0.1 1 10 100 300
0
1
2
3
4
5
SINGLE PULSE TIME (SEC)
POWER (W)
SINGLE PULSE
R =180°C/W
T = 25°C
θ
JA
A
0.0001 0.001 0.01 0.1 1 10 100 300
0.01
0.02
0.05
0.1
0.2
0.5
1
t , TIME (sec)
TRANSIENT THERMAL RESISTANCE
1
Single Pulse
D = 0.5
0.1
0.05
0.02
0.01
0.2
r(t), NORMALIZED EFFECTIVE
Duty Cycle, D = t / t
1
2
T - T = P * R (t)
θ
JA
A
J
P(pk)
t
1
t
2
R (t) = r(t) * R
R =
180
°C/W
θ
JA
θ
JA
θ
JA
01234
0
1
2
3
4
5
Q , GAT E CHARGE (nC)
-V , GATE-SOURCE VOLTAGE (V)
g
GS
V = -5V
DS
-15V
I = -1.9A
D
-10V
0.1 0.2 0.5 1 2 5 10 20
30
100
300
1000
-V , DRAIN TO SOURCE VOLTAGE (V)
CAPACITANCE (pF)
DS
C
is s
f = 1 MHz
V = 0 V
GS
C
oss
C
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