Data Sheet

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3
FAN3226 / FAN3227 / FAN3228 / FAN3229 — Dual 2-A High-Speed, Low-Side Gate Drivers FAN3226 / FAN3227 / FAN3228 / FAN3229 D l 2 A Hi h Sd L Sid G t D i
Package Outlines
1
8
7
2
6
3
4
5
2
3
8
6
1
4
7
5
Figure 2. 3x3 mm MLP-8 (Top View) Figure 3. SOIC-8 (Top View)
Thermal Characteristics
(2)
Package
Θ
JL
(3)
Θ
JT
(4)
Θ
JA
(5)
Ψ
JB
(6)
Ψ
JT
(7)
Unit
8-Lead 3x3 mm Molded Leadless Package (MLP)
1.6
68
43
3.5
0.8
°C/W
8-Pin Small Outline Integrated Circuit (SOIC)
40
31
89
43
3.0
°C/W
Notes:
2. Estimates derived from thermal simulation; actual values depend on the application.
3.
Theta_JL (Θ
JL
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
4. Theta_JT (Θ
JT
): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
5. Theta_JA (Θ
JA
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airfl ow.
The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
6. Psi _JB (Ψ
JB
): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 5. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
7. Psi _JT (Ψ
JT
): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 5.