Data Sheet

3
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FAN2001/FAN2002 Rev. 1.0.2
FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter
Absolute Maximum Ratings (Note1)
Recommended Operating Conditions
Notes:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are referenced to AGND.
2. Junction to ambient thermal resistance, θ
JA
, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of
via used, diameter of via used, available copper surface, and attached heat sink characteristics.
3. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
4. Refer to the applications section for further details.
Parameter Min Max Unit
V
IN
, PV
IN
-0.3 7 V
Voltage On Any Other Pin -0.3 V
IN
V
Lead Soldering Temperature (10 seconds) 260 °C
Junction Temperature 150 °C
Storage Temperature -65 150 °C
Thermal Resistance-Junction to Tab
( θ
JC
)
,
3x3mm 6-lead MLP (Note 2)
8 °C/W
Electrostatic Discharge Protection (ESD) Level (Note 3) HBM 4 kV
CDM 1
Parameter Min Typ Max Unit
Supply Voltage Range 2.5 5.5 V
Output Voltage Range, Adjustable Version 0.8 V
IN
V
Output Current 1A
Inductor (Note 4) 3.3 µ H
Input Capacitor (Note 4) 10 µF
Output Capacitor (Note 4) 2 x 10 µF
Operating Ambient Temperature Range -40 +85 °C
Operating Junction Temperature Range -40 +125 °C