Datasheet

BD676, BD676A, BD678, BD678A, BD680, BD680A, BD682, BD682T
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
C
= 25_C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (Note 1) BD676, 676A
(I
C
= 50 mAdc, I
B
= 0) BD678, 678A
BD680, 680A
BD682
BV
CEO
45
60
80
100
Vdc
Collector Cutoff Current (V
CE
= Half Rated V
CEO
, I
B
= 0) I
CEO
500
mAdc
Collector Cutoff Current
(V
CB
= Rated BV
CEO
, I
E
= 0)
(V
CB
= Rated BV
CEO
. I
E
= 0, T
C
= 100°C)
I
CBO
0.2
2.0
mAdc
Emitter Cutoff Current (V
BE
= 5.0 Vdc, I
C
= 0) I
EBO
2.0 mAdc
ON CHARACTERISTICS
DC Current Gain (Note 1)
(I
C
= 1.5 Adc, V
CE
= 3.0 Vdc) BD676, 678, 680, 682
(I
C
= 2.0 Adc, V
CE
= 3.0 Vdc) BD676A, 678A, 680A
h
FE
750
750
CollectorEmitter Saturation Voltage (Note 1)
(I
C
= 1.5 Adc, I
B
= 30 mAdc) BD678, 680, 682
(I
C
= 2.0 Adc, I
B
= 40 mAdc) BD676A, 678A, 680A
V
CE(sat)
2.5
2.8
Vdc
BaseEmitter On Voltage (Note 1)
(I
C
= 1.5 Adc, V
CE
= 3.0 Vdc) BD678, 680, 682
(I
C
= 2.0 Adc, V
CE
= 3.0 Vdc) BD676A, 678A, 680A
V
BE(on)
2.5
2.5
Vdc
DYNAMIC CHARACTERISTICS
SmallSignal Current Gain (I
C
= 1.5 Adc, V
CE
= 3.0 Vdc, f = 1.0 MHz) h
fe
1.0
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
50
40
10
5.0
0
15 30 45 60 75 105 135 150 165
Figure 1. Power Temperature Derating
T
C
, CASE TEMPERATURE (°C)
P
D
, POWER DISSIPATION (WATTS)
12090
45
20
15
30
25
35
Figure 2. DC Safe Operating Area
5.0
1.0
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
2.0
1.0
0.5
0.05
2.0 5.0 10 50 100
BONDING WIRE LIMIT
THERMAL LIMIT at T
C
= 25°C
SECONDARY BREAKDOWN LIMIT
0.2
0.1
I
C
, COLLECTOR CURRENT (AMP)
T
C
= 25°C
BD676, 676A
BD678, 678A
BD680, 680A
BD682
20
There are two limitations on the power handling ability of
a transistor average junction temperature and secondary
breakdown. Safe operating area curves indicate I
C
V
CE
limits of the transistor that must be observed for reliable
operation; e.g., the transistor must not be subjected to greater
dissipation than the curves indicate.
At high case temperatures, thermal limitations will reduce
the power that can be handled to values less than the
limitations imposed by secondary breakdown.