Data Sheet
74LCX245 — Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs
©1994 Fairchild Semiconductor Corporation www.fairchildsemi.com
74LCX245 Rev. 1.11.1
74LCX245
Low Voltage Bidirectional Transceiver with 5V Tolerant
Inputs and Outputs
Features
■
5V tolerant inputs and outputs
■
2.3V to 3.6V V
CC
specifications provided
■
7.0ns t
PD
max. (V
CC
=
3.3V), 10µA I
CC
max.
■
Power down high impedance inputs and outputs
■
Supports live insertion/withdrawal
(1)
■
±24mA output drive (V
CC
=
3.0V)
■
■
Latch-up performance exceeds 500mA
■
ESD performance:
– Human body model
>
2000V
– Machine model
>
200V
■
Leadless DQFN package
Note:
1. To ensure the high-impedance state during power up
or down, OE should be tied to V
CC
through a pull-up
resistor: the minimum value or the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX245 contains eight non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is designed for low
voltage (2.5V and 3.3V) V
CC
applications with capability
of interfacing to a 5V signal environment. The T/R
input
determines the direction of data flow through the device.
The OE input disables both the A and B ports by placing
them in a high impedance state.
The LCX245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number Package Description
74LCX245WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX245SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX245BQX
(2)
MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
74LCX245MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX245MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Implements
proprietary
noise/EMI reduction circuitry
December 2013