Datasheet

Common Precautions for All MOS FET Relays
58
DIP
SOP
SSOP
USOP
VSON
S-VSON
General-purpose
Introduction
High-load-voltage Multi-contact-pair
(2a, 2b, and 1a1b)
High-current and
Low-ON-resistance
Small and High-
dielectric-strength
High-dielectric-
strength
Current-limiting
Low-output-capacitance
and Low-ON-resistance
Small and High-
load-voltage
Certified Models with
Standards Certification
Common Precautions for All MOS FET Relays
●Cleaning Flux from the MOS FET Relays
(1) Clean flux from the MOS FET Relay so that there will be no
residue of reactive ions, such as sodium or chlorine.
Some organic solvents will react with water to produce
hydrogen chloride or other corrosive gases, which may
cause deterioration of the MOS FET Relays.
(2) When washing off the flux with water, make sure that there
will be no residue of reactive ions, particularly sodium or
chlorine.
(3) During water washing, do not scrub the marks on the
surface of the MOS FET Relay with a brush or your hand
while there is cleaning liquid on the MOS FET Relay. The
marks may come off.
(4) Clean the flux from the MOS FET Relays with the chemical
action of the solvent for submersed cleaning, shower cleaning,
or steam cleaning. To minimize the effect on the MOS FET
Relays, do not place the MOS FET Relay in the solvent or
steam for more than 1 minute at a temperature of 50°C.
(5) If you use ultrasonic cleaning, keep the time short. If the
cleaning time is too long, the sealing characteristics of the
molded resin and frame materials may deteriorate.
The recommended basic conditions are given below.
Recommended Conditions for Ultrasonic Cleaning:
Frequency: 27 to 29 kHz
Ultrasonic wave output: 300 W max. (0.25 W/cm
2
max.)
Cleaning time: 30 s max.
Also, suspend the MOS FET Relays in the cleaning solution so
that the MOS FET Relay and PCB do not come into direct
contact with the ultrasonic transducer.
●Solder Mounting
Perform solder mounting under the following recommended
conditions to prevent the temperature of the MOS FET Relays
from rising.
<Flow Soldering>
PCB Terminals
(Set Temperature of Flow Bath)
Note: We recommend that you verify the suitability of solder mounting under
actual conditions.
Surface-mount Terminals
If you are considering mounting a surface mount pin type by flow
soldering, please consult us.
<Reflow Soldering>
Surface-mount Terminals
(Surface Temperature of Package)
(Lead-free solder) SnAgCu recommended profile
Note: 1. We recommend that you verify the suitability of solder mounting under
actual conditions.
2. When SSOP, USOP, VSON, or S-VSON products are ordered with
(TR), tape package product is delivered in moisture-proof packaging.
If ordered without (TR), tape-cut product is delivered in non moisture-
proof packaging. Mount a tape cut product by manual soldering. Tape
cut products absorb moisture because a non moisture-proof package
is used. Risk of package cracking or other damage due to thermal
stress if reflow soldering is performed.
Manual Soldering (Once Only)
Perform manual soldering at 350°C for 3 s or less or at 260°C
for 10 s or less.
Note: Please consult us for manual soldering conditions for S-VSON
products.
●Storage Conditions
(1) Store the MOS FET Relay where they will not be subjected
to water leaks or direct sunlight.
(2) When transporting or storing the MOS FET Relays, observe
all precautions on the packaging boxes.
(3) Keep the storage location at normal temperature, normal
humidity, and normal pressure. Guidelines for the
temperature and humidity are 5 to 35°C and a relative
humidity of 45% to 75%.
(4) Do not store the MOS FET Relay in locations that are
subject to corrosive gases, such as hydrogen sulfide gas, or
to salt spray, and do not store them where there is visually
apparent dust or dirt.
(5) Store the MOS FET Relay in a location that has a relatively
stable temperature. Radical changes in temperature during
storage will cause condensation, which may oxidize or
corrode the leads and interfere with solder wetting.
(6) If you remove MOS FET Relays from the packages and then
store them again, use storage containers that have
measures to prevent static electricity.
(7) Do not under any circumstances apply any force to the MOS
FET Relays that would deform or alter them in any way.
(8) This product is warranted for one year from the date of
purchase or the date of delivery to the specified location.
If the MOS FET Relays are stored for more than about one
year under normal conditions, we recommend that you
confirm solderability before you use the MOS FET Relays.
Solder type Preheating Soldering Count
(Lead solder)
SnPb
150
°C
60 to 120 s
260°C
10 s max.
Once only
(Lead-free solder)
SnAgCu
150
°C
60 to 120 s
260°C
10 s max.
Once only
Solder type Preheating Soldering Count
(Lead solder)
SnPb
140 to 160
°C
60 to 120 s
210°C
30 s max.
Peak:
240
°C max.
Up to twice
60 to 120
60 to 150
30MAX
Time (s)Reflow repetitions : Up to twice
255
217
3°C/s 6°C/s
260°C PEAK
200
150
25
Surface Temperature of Package