User's Manual
134
Section 6 Chemical Resistance of Tags
RFID System
User's Manual
Section 6
Appendices
Applicable Models
Chemicals that affect Tags are shown below.
ABS resin is used for case material and epoxy resin for filling material. Refer to the following lists and
do not use chemicals that affect ABS and epoxy resin.
Tags cannot be used in applications with explosion-proof specifications.
Chemicals That Cause Deformations, Cracks, Etc.
Chemicals That May Cause Discoloration, Swelling, Etc.
Chemicals That Do Not Affect ABS Resin or Epoxy Resin
Note: The above results are from tests conducted a room temperature (23°C). Even if the chemicals
do not affect the ABS or epoxy resins at room temperature, they may affect the resins at higher
or lower temperatures. Check the chemicals carefully in advance.
V680-D2KF67/67M
ABS resin Epoxy resin
Trichlene, acetone, xylene, toluene, gasoline, creosol,
methylene chloride, phenol, cyclohexane, aqua regia, chromic
acid, sulfuric acid (90% RT), methyl ethyl ketone, aniline,
nitrobenzine, monochlorobenzine, pyridine, nitric acid (60%
RT), formic acid (80% RT)
Aqua regia, chromic acid, sulfuric acid (90% RT), nitric acid
(60% RT), ammonia solution, acetone, methylene chloride,
phenol
ABS resin Epoxy resin
Hydrochloric acid, alcohol, Freon, sodium hydroxide, hydrogen
peroxide, benzine, sulfuric acid (10% RT), nitric acid (10%
RT), phosphoric acid (85% RT), ammonia solution
Sulfuric acid (10% RT), nitric acid (10% RT), hydrochloric acid
(30% RT), acetic acid (50% RT), oxalic acid, calcium
hydroxide, benzine, creosol, alcohol, cyclohexane, toluene,
xylene, benzine, grease
ABS resin Epoxy resin
Ammonia, kerosine, mineral oil, developer, Yushiroken S50,
Chemi-Cool Z, Velocity No. 3, Yushiroken EEE-30Y,
petroleum, grease, acetic acid, oxalic acid, calcium hydroxide,
phosphoric acid (30% RT), hydrochloric acid (10% RT),
potassium hydroxide
Ammonia, hydrochloric acid (10% RT), potassium hydroxide,
petroleum, gasoline, Yushiroken S50, Chemi-Cool Z, Velocity
No. 3, Yushiroken EEE-30Y