Datasheet

12
1-2. Wire Bonders
Position Detection on X-Y Tables
Mechanical problems are prevented by
detecting the limits along the X and Y axes.
Applicable Models
Reflective Sensor with
Sensitivity Adjustment
EE-SY671
Position Detection for Reed Frame Cases
Applicable Models
Built-in Connector for Downsizing
and Easier Connection
EE-SX970
EE-SPY301
EE-SX970
Reed frame
EE-SPY301
When die bonding is completed, a wire
bonder connects gold wires between
the semiconductor chips and reed
frames.
EE-SPY301/401
EE-SPY302/402
EE-SY671/672
EESX67/47 Series
EESX77/787 Series
EESX91 Series
EE-SPY301/401
EE-SY671/672
EE-SX97 Series
First, a Sensor at the bottom detects when the reed frame
case has reached the proper position. Two other Sensors
detect the start and stop points of the case as it rises up and
reed frames are taken out.