Datasheet

11
1. Semiconductor Equipment
1-1. Die Bonders
Position Detection on X-Y Tables
Mechanical problems are prevented by detecting
the limits along the X and Y axes.
Applicable Models
Modulated Light for Applications
Subject to External Light Interference
EE-SPY302
Position Detection for Reed Frame Cases
Applicable Models
Die bonders lift semiconductor chips of
precut semiconductor wafers with a
suction nozzle and bond then to reed
frames.
EE-SPY301/401
EE-SPY302/402
EE-SY671/672
EE-SX67/47 Series
EE-SX77/87 Series
EE-SX91 Series
EE-SX97 Series
First a Sensor detects the lower limit of the case in which reed frames are
set. The reed frames are then taken out one at a time as the case rises unit
another Sensor detects the upper limit and the next case is moved into place.
EE-SX770
Built-in Connector for Downsizing and
Easier Connection
EE-SX970
EE-SX910-R
EE-SX970