Datasheet

8
G6S Surface-mounting Relay
G
6
S
■Recommended Soldering Method
(1) IRS Method (Mounting Solder: Lead)
(2) IRS Method (Mounting Solder: Lead-free)
• The thickness of cream solder to be applied should be within a
range between 150 and 200 µm on OMRON’s recommended
PCB pattern.
• In order to perform correct soldering, it is recommended that
the correct soldering conditions be maintained as shown
below on the left side.
Visually check that the Relay is properly soldered.
■Approved Standards
UL recognized: (File No. E41515)
CSA certified: (File No. LR31928)
BSI (EN62368-1) (File No.VC657351) (-Y type)
■Precautions
• Please refer to “PCB Relays Common Precautions” for correct use.
• Long-term Continuously ON Contacts
• Using the Relay in a circuit where the Relay will be ON
continuously for long periods (without switching) can lead to
unstable contacts because the heat generated by the coil itself
will affect the insulation, causing a film to develop on the
contact surfaces. We recommend using a latching relay
(magnetic-holding relay) in this kind of circuit. If a single-side
stable model must be used in this kind of circuit, we
recommend using a fail-safe circuit design that provides
protection against contact failure or coil burnout.
• Relay Handling
• Use the Relay as soon as possible after opening the
moistureproof package. (As a guideline, use the Relay within
one week at 30°C or less and 60% RH or less.) If the Relay is
left for a long time after opening the moisture-proof package,
the appearance may suffer and seal failure may occur after the
solder mounting process. To store the Relay after opening the
moisture-proof package, place it into the original package and
sealed the package with adhesive tape.
• When washing the product after soldering the Relay to a PCB,
use a water-based solvent or alcohol-based solvent, and keep
the solvent temperature to less than 40°C. Do not put the
Relay in a cold cleaning bath immediately after soldering.
• Claw Securing Force During Automatic Mounting
150
20 to 30
220 to 240
180 to 200
Soldering
Preheating
Time (s)
90 to 120
Temperature (°C)
(The temperature profile indicates the temperature on the circuit board
surface.)
250 max.
230
180
150
Time (s)
120 max. 30 max.
Relay terminal
section
Soldering
Preheating
Uppwe surface of case
(peak): 255°C max.
Temperature (°C)
(The temperature profile indicates the temperature on the PCB.)
Insufficient amount
of solder
Excessive amount
of solder
Heel fillet
is formed
Solder
PCB
Land
Terminal
Relay
Correct Soldering Incorrect Soldering
Contact form Coil ratings Contact ratings
Number of test
operations
DPDT (2c) 3 to 24 VDC
3 A, 30 VDC at 40°C
0.3 A, 110 VDC at 40°C
0.5 A, 125 VAC at 40°C
6,000
Contact form Isolation category Voltage
DPDT (2c)
Supplementary Insulation 250 VAC
Correct Use