Datasheet

7
G3VM-26M10/26M11/66M MOS FET Relay Module
4)Dip cleaning, shower cleaning, and steam cleaning are
performed by chemical action of solvent. Consider
immersion time in solvent and steam within 1 minute at
liquid temperature of 50°C or less, taking into
consideration influence on MOS FET relay.
5)Dry thoroughly after cleaning so that there is no residue of
cleaning solution.
(6) Soldering mounting
Soldering should be performed within the recommended
conditions below to prevent the temperature rise of the main
body as much as possible.
Note: When using, we recommend you to check under customer’s actual use
conditions.
● Recommended conditions for IRS Method
(7) Transporting
Do not transport under the condition that the MOS FET relay
is not packaged. It may cause damage or breakdown.
(8) Wiring
1)Use a power supply with low noise.
2)Do not wire any wiring in the same duct or conduit as
power or high-tension lines. Otherwise, inductive noise
may damage the MOS FET relay or cause it to
malfunction.
3)Do not handle the MOS FET relay with oily or dusty
(especially iron dust) hands.
(9) Storage conditions
1)Please keep it in a place where there is no possibility of
water or where it is not exposed to direct sunlight.
2)When transporting or storing, follow the warning notice to
the packing tube.
3)Please keep the storage place at normal temperature,
normal humidity and normal pressure. Temperature and
relative humidity should be 5 to 35°C, relative humidity 45
to 75% as a guide.
4)Store in a place where corrosive gas, such as hydrogen
sulfide gas and salt wind, do not hit the product and where
there is no dust that can be visually confirmed.
5) Please keep MOS FET relay in a place with little
temperature change. Drastic temperature change during
storage leads to dew condensation, lead oxidation,
corrosion, etc., causing poor solder wettability.
6)When removing the MOS FET relay from the packaging
and storing it again, please use the antistatic storage
container.
7)In any case, please do not add power to make the product
deform or alter.
8)The warranty period of our products will be one year after
delivery or after delivery to the designated location. We
recommend that you check the solderability before use if
over a year or more has passed in normal storage mode.
9)When storing, keep the packing bag without opening it.
Use it within 72 hours after opening.
(10)Terms of use
<Temperature>
Each electrical characteristic of the MOS FET relay is limited
by the operating temperature. If it is used at a temperature
outside the operating range, not only the electrical
characteristics are not realized, but also the deterioration of
the MOS FET relay is accelerated. For this reason, please
note the temperature characteristics beforehand and design
with
*derating. (* Derating: Reduce stress)
For operating temperature condition, consider the derating
and use the recommended operating temperature as a
guide.
<Humidity>
Long-term use under high humidity environment may cause
deterioration or malfunction of internal chip due to moisture
intrusion into inside the MOS FET relay. In systems with high
signal source impedance, this board leaks and leakage
between the leads of the MOS FET relay may cause
malfunction. In such a case, please consider the moisture
proof treatment of the MOS FET relay surface.
Meanwhile, at low humidity, damage due to discharge of
static electricity becomes a problem, so please use it in the
humidity range of relative humidity 40 to 60% unless
moisture proof treatment is carried out.
(11)About static electricity countermeasures
If static electricity is discharged to each terminal at the time
of product handling etc., it may cause damage to the internal
elements or degradation of function. Minimize the generation
of static electricity as much as possible and take appropriate
countermeasures against static electricity to prevent electric
charge from accumulating around the product.
(12)MOS FET Relay Output Noise Surges
If there is a large voltage surge in the AC current being used
by the MOS FET Relay, the MOS FET Relay transient peak
element voltage will be exceeded, causing overvoltage dam-
age to the MOS FET Relay. Be sure to take countermea-
sures against surge, such as adding a surge absorbing
element.
Mounting solder
Preliminary
heating
Soldering Times
(Lead-free solder)
SnAgCu
120 to 170°C
130 seconds or
less
200°C
50 seconds
or less
peak
220°C or
less
Only
once
Temperature at package bottom (°C)
Time (s)
250
220
200
200 250
350
300
175
150
150
130 max.
120
100
100
50
50
0
0
50 max.
20 max.