Datasheet

6
G3VM-26M10/26M11/66M MOS FET Relay Module
Safety Precautions
Always turn OFF the power supply before performing wiring. Not
doing so may cause electrical shock.
(1) Do not apply overvoltage or overcurrent to the input circuit /
output circuit of the MOS FET relay.
This can occasionally cause failure or burning of the MOS
FET relay.
(2) Please follow recommended soldering condition. Incomplete
soldering procedure can lead to abnormal heat generation
during operation and result in heat damage to internal com-
ponents.
(3) Do not transport the MOS FET relay under the following loca-
tions. Doing so may occasionally result in damage, malfunc-
tion, or deterioration of performance characteristics.
• Locations subject to water or oil
• Locations subject to high temperature or high humidity
• Locations subject to condensation due to rapid changes in
temperature
(4) Do not use or store the MOS FET relay in the following loca-
tions. Doing so may result in damage, malfunction, or deteri-
oration of performance characteristics.
• Locations subject to corrosive gases or inflammable gases
• Locations subject to temperature beyond specified condi-
tions
• Locations subject to humidity beyond specified conditions
• Locations subject to high temperature or high humidity
• Locations subject to dust, salt, or iron, or locations where
there is salt damage
• Locations subject to rainwater or water splashes
• Locations subject to direct sunlight
(5) Do not drop the MOS FET relay or subject it to abnormal vibra-
tion or shock during transportation or mounting. Doing so may
result in deterioration of performance, malfunction, or failure.
(6) Make sure that the hand soldering is only once at 260°C or
less within 20 seconds. Also, do not attach the soldering iron
directly to the plating part of the MOS FET relay, so attach
the soldering iron to the pad part of the substrate to be
mounted. If it is done twice or more including rework, the
plating part of the MOS FET relay may peel off and there is a
possibility of poor conduction.
(7) Make sure that there is no excess ambient temperature rise
due to the heat generation of the MOS FET relay. If the MOS
FET relay is mounted inside a panel, install a fan so that the
interior of the panel is fully ventilated.
(8) Select a load within the rated values. Not doing so may result
in malfunction, failure, or burning.
(9) Use a power supply within the rated frequencies. Otherwise,
malfunction, failure, or burning may occasionally occur.
(10)The MOS FET relay may occasionally rupture if short-circuit
current flows. As protection against accidents due to short
circuiting, be sure to install protective devices, such as fuses
and no-fuse breakers, on the power supply side.
(11)If a voltage is generated from the stray capacitance to cause
a return failure, connect a bleeder resistor to input end.
(1) Derating design
Consideration for derating is critical for achieving required
system reliability. Attention should be paid for derating
against maximum rating and recommended operating condi-
tions. In addition to this, there should be enough margin
based on machine and environmental conditions.
1)Maximum rating
The maximum rating is a standard that must not be
exceeded even momentarily and can not exceed any of
multiple ratings. If it exceeds the maximum rating,
degradation inside the MOS FET relay and breakage of
the chip may result. For this reason, in order to use the
MOS FET relay with high reliability, please design a
sufficient derating against the maximum rated voltage,
current and temperature.
2)Recommended Operating Conditions
Recommended operating conditions are recommended
conditions to ensure operation and return of MOS FET
relays. In order to use the MOS FET relay with high
reliability, please consider the recommended operating
conditions and design.
3)Fail-safe implementation
If there is a possibility that failure, characteristic
deterioration, malfunction, etc. of the MOS FET relay will
have a serious effect on the safe operation of the system,
we recommend implementing a fail-safe measure
according to the application.
(2) Protection against input surge voltage
When a surge voltage in the reverse direction is applied to
the input terminal, insert a diode anti-parallel to the input ter-
minal and do not apply a reverse voltage of 3 V or more.
(3) Protection circuit against overvoltage on the output side
In the case of an inductive load or the like where an overvolt-
age exceeding the absolute maximum rating occurs between
the output terminals, connect a protection circuit to limit the
overvoltage.
(4) About load connection method
If short-circuiting the input / output terminals during operation
of the MOS FET relay will cause malfunction, do not short
circuit.
(5) Cleaning
1)For flux cleaning, please clean so that reactive ions such
as sodium and chlorine do not remain. Depending on the
organic solvent, it may react with water to generate
corrosive gases such as hydrogen chloride, which may
degrade the MOS FET relay.
2)Before cleaning with water, please do not leave any
reactive ions such as sodium, chlorine, etc. in particular.
3)Do not scrub the display mark face with a brush or hand
while washing or with cleaning solution adhering to the
MOS FET relay. The display mark may disappear.
Caution
Precautions for Safe Use
Precautions for Correct Use