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CAUTION: This temperature sensor is sensitive to electrostatic discharge (ESD). Use ESD
precautionary procedures when handling, or making mechanical or electrical connections to this
device in order to avoid performance degradation or loss of functionality.
There are three aspects of using a cryogenic
temperature sensor which are critical to its
optimum performance. The first involves the proper
mounting of the sensor package, the second
relates the proper joining of sensor lead wires and
connecting wires. The final concern is the thermal
anchoring of the lead wires. Although the
sequence in which these areas should be
addressed is not fixed, all elements covered under
each aspect should be adhered to for maximum
operating capabilities of the sensor.
CAUTION: The braze ring that wraps around
the base of the sensor is electrically
connected to the positive (+) lead. Use
caution not to cause a short by letting the
braze ring come in contact with electrically-
conductive material.
SENSOR MOUNTING
1. Mounting area should be prepared and
cleaned with a solvent such as acetone
followed by an isopropyl alcohol rinse. Allow
time for the solvents to evaporate before
sensor mounting.
2. T
he list below provides brief instructions on mounting a sensor using a number of different methods. The constraints of
your application should dictate the most appropriate mounting method to follow.
Mechanical – T
he preferred method for mechanically mounting an SD sensor is using the Lake Shore spring loaded
clamp. This clamp should be ordered at the time the sensor is ordered (P/N DT-670-CO, DT-470-CO, etc.). The clamp
holds the SD sensor in contact with the surface and also allows the sensor to be easily changed or replaced. A thin layer
of Apiezon
®
N Grease (≤0.055 mm) or a flat 100% indium preform should be used between the sensor and mounting
surface to enhance thermal contact. The spring prevents crushing the sensor.
Indium Solder (
100% In) – A low wattage heat source should be used and the sensor must never exceed 200 °C. The
mounting surface and sensor should be tinned with a rosin flux (type RMA is recommended) prior to mounting the sensor.
A thin, uniform layer of indium solder should be the goal. Clean both the sensor and mounting surface of residual flux
using rosin residue remover. Once the surface area is dry, reheat the mounting surface to the melting point of the solder
(156 °C). Press the sensor into position and allow it to warm to the melting point of the solder. Remove heat source and
allow sufficient time for the solder to solidify (typically 2 to 3 s) before removing it.
Apiezon
®
N Grease – Is best used as a thermal conductor when the sensor is mounted in a hole or recess and when the
sensor is intended to be removed. The sensor should be surrounded with thermal grease and placed into the mounting
position. When the temperature is lowered the thermal grease will harden, giving good support and thermal contact.
IMI 7031 Varnish – P
repare varnish and apply a thin layer on the mounting surface. Press the sensor firmly against the
varnish during curing to ensure a thin bond layer and good thermal contact. Varnish will air dry in 5 to 10 min. Sufficient
time must be allowed for the solvents in the varnish to evaporate. There is a small probability of ionic shunting across the
sensor during the full cure period of the varnish (typically 12 to 24 h).
Stycast
®
2850FT Epoxy – Prepare epoxy and apply a thin layer on the mounting surface. Press the sensor firmly into the
epoxy during curing to assure a thin bond layer and good thermal contact. Epoxy will cure in 12 h at 25 °C or in 2 h at
66 °C.
3. F
ollow manufacturer’s instructions for adhesive curing schedule. Never heat the sensor above 200 °C.