Datasheet

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B60/C60 Series
Heat Sink System
Ohmite introduces the powerful B60/
C60 series heatsink with cam clip (Pat.
Pending) or custom mounting. This
series offers flexible, high performance
and compact heat sink with exchange-
able cam clip system for TO-247 and
TO-264 devices. The built in lip is pro-
vided for mounting ease. The optional B
series can be tapped for popular Ohmite
resistors or other devices. These power-
ful heat sinks can be thru-hole soldered
as a single or dual unit. The dual unit
can be mated to a 60mm fan for greater
thermal performance. It is the ideal type
of heat sink for high power density and
small size (3U or 4U) electronic packag-
ing with forced convection.
CHARACTERISTICS
Heat Sink
Aluminum Alloy 6063-T5 or Equivalent with either degreased or black
anodized finish.
Spring Clip
Music Wire, Per ASTM A228 with bright nickel plating
Solder Foot
Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike.
RoHS compliant.
Fan
60mm fan with 4 self-tapping M3.5 screws
Interface Thermal
Resistance
For improvement, use thermal joint compound, 0.005 Grafoil (TGon
800 by Laird), or phase change material (Hi-Flow by Bergquist)
Insulator (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist
Heatsink Surface Area Weight Length L
Part Number (in
2
/ mm
2
) (oz / g) (mm)
C60-075-VE 177 / 114,300 5.7 / 163 75
C60-075-AE
B60-075-VE 177 / 114,300 5.7 / 163 75
B60-075-AE
SERIES SPECIFICATIONS
consult factory for
alternate lengths and
clip combinations
Fan Flow Rate (cfm)
30 40 5020
Thermal Resistance from Case to
Ambient per Device (oC/watts)
0
1.5
2
1
0.5
2 devices
4 devices
Heat Dissipation
(continued)