Datasheet

TJA1024 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 1 — 12 February 2015 21 of 25
NXP Semiconductors
TJA1024
Quad LIN 2.2A/SAE J2602 transceiver
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of DHVQFN packages
Section 16 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering DHVQFN
leadless package ICs can be found in the following application notes:
• AN10365 “Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
MSL: Moisture Sensitivity Level
Fig 8. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature