Datasheet

3.2 Ordering information
F/P S32 K 1 0 0 X Y F0 M LC R
Product status
Product type/brand
Product line
Series/Family
(including generation)
Core platform/
Performance
Memory size
Ordering option 1: Letter
Ordering option 2: Letter
Fab and Mask
rev. letter
Temperature
Package
Tape and Reel
Product status
P: Prototype
F: Qualified ordering P/N
Product type/brand
S32: Automotive 32-bit MCU
Product line
K: ARM Cortex MCUs
M: MagniV/Mixed Signal
Series/Family
1: 1st product series
2: 2nd product series
Core platform/Performance
1: ARM Cortex M0+
4: ARM Cortex M4F
Memory size
M0+
2
4
6
8
M4F
256 K
512 K
128 K
1 M
256 K
2 M
Ordering option
X: Speed
B: 48 MHz without DMA (only for S32K11x)
L: 48 MHz with DMA (only for S32K11x)
M: 64 MHz
H: 80 MHz
U: 112 MHz
Y: Optional feature
N: No/None
R: Max. RAM
F: CAN-FD and FlexIO including max. RAM
S: Security including max. RAM
A: CAN-FD, FlexIO, and Security including max. RAM
E: Ethernet and audio including max. RAM
J: CAN FD, FlexIO, Security, Ethernet
and audio including max. RAM
Fab and Mask rev. letter
Fx: ATMC
Tx: GF
XX: Flex #
x0: 1st fab revision
x1: 2nd fab revision
Temperature
C: -40C to 85C
V: -40C to 105C
M: -40C to 125C
Tape and Reel
T: Trays and Tubes
R: Tape and Reel
Package
LQFP
LQFP
-EP
32
LC
FM
Pins
QFN
BGA
48
64
100
144
176
LL
LF
LH
LQ
LU
KF
KH
FT
MH
-
-
-
-
-
-
-
-
-
-
-
-
-
32 K
64 K
Figure 4. Ordering information
Ordering parts
S32K1xx Data Sheet, Rev. 4, 06/2017
8
Preliminary
NXP Semiconductors