Datasheet

Table 39. Thermal characteristics for the 100 MAPBGA package
Rating Conditions Symbol Values Unit
S32K146 S32K144 S32K148
Thermal resistance, Junction to Ambient (Natural
Convection)
1, 2
Single layer board (1s) R
θJA
57.2 61.0 52.5 °C/W
Thermal resistance, Junction to Ambient (Natural
Convection)
1, 2, 3
Four layer board
(2s2p)
R
θJA
32.1 35.6 27.5 °C/W
Thermal resistance, Junction to Ambient (@200 ft/min)
1, 2, 3
Single layer board (1s) R
θJMA
44.1 46.6 39.0 °C/W
Thermal resistance, Junction to Ambient (@200 ft/min)
1, 3
Two layer board
(2s2p)
R
θJMA
27.2 30.9 22.8 °C/W
Thermal resistance, Junction to Board
4
— R
θJB
15.3 18.9 11.2 °C/W
Thermal resistance, Junction to Case
5
— R
θJC
10.2 14.2 7.5 °C/W
Thermal resistance, Junction to Package Top outside
center
6
— ψ
JT
0.2 0.4 0.2 °C/W
Thermal resistance, Junction to Package Bottom outside
center
7
— ψ
JB
12.2 15.9 18.3 °C/W
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air
flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the
package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek
letters are not available, the thermal characterization parameter is written as Psi-JT.
7. Thermal characterization parameter indicating the temperature difference between package bottom center and the junction temperature per JEDEC JESD51-12.
When Greek letters are not available, the thermal characterization parameter is written as Psi-JB.
Thermal attributes
S32K1xx Data Sheet, Rev. 4, 06/2017
NXP Semiconductors
Preliminary
63