Datasheet

Table 38. Thermal characteristics for the 64/100/144/176-pin LQFP package (continued)
Rating Conditions Symbol Packages Values Unit
S32K11x S32K142 S32K144 S32K146 S32K148
Thermal resistance, Junction to Case
5
— R
θJC
64 TBD 13 12 11 NA °C/W
100 TBD 13 12 11 NA °C/W
144 TBD NA NA 12 9 °C/W
176 TBD NA NA NA 9 °C/W
Thermal resistance, Junction to Package
Top
6
Natural
Convection
ψ
JT
64 TBD 2 2 2 NA °C/W
100 TBD 2 2 2 NA °C/W
144 TBD NA NA 2 1 °C/W
176 TBD NA NA NA 1 °C/W
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air
flow, power dissipation of other components on the board, and board thermal resistance.
2. Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively.
3. Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the
package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek
letters are not available, the thermal characterization parameter is written as Psi-JT.
Thermal attributes
S32K1xx Data Sheet, Rev. 4, 06/2017
62
Preliminary
NXP Semiconductors