Datasheet

Table 38. Thermal characteristics for the 64/100/144/176-pin LQFP package
Rating Conditions Symbol Packages Values Unit
S32K11x S32K142 S32K144 S32K146 S32K148
Thermal resistance, Junction to Ambient
(Natural Convection)
1, 2
Single layer
board (1s)
R
θJA
64 TBD 61 61 59 NA °C/W
100 TBD 53 52 21 NA °C/W
144 TBD NA NA 51 44 °C/W
176 TBD NA NA NA 42 °C/W
Thermal resistance, Junction to Ambient
(Natural Convection)
1
Two layer board
(1s1p)
R
θJA
64 TBD 45 45 44 NA °C/W
100 TBD 42 42 40 NA °C/W
144 TBD NA NA 44 37 °C/W
176 TBD NA NA NA 36 °C/W
Thermal resistance, Junction to Ambient
(Natural Convection)
1, 2
Four layer board
(2s2p)
R
θJA
64 TBD 43 43 41 NA °C/W
100 TBD 40 40 39 NA °C/W
144 TBD NA NA 42 36 °C/W
176 TBD NA NA NA 35 °C/W
Thermal resistance, Junction to Ambient
(@200 ft/min)
1, 3
Single layer
board (1s)
R
θJMA
64 TBD 49 49 48 NA °C/W
100 TBD 43 42 41 NA °C/W
144 TBD NA NA 42 36 °C/W
176 TBD NA NA NA 34 °C/W
Thermal resistance, Junction to Ambient
(@200 ft/min)
1
Two layer board
(1s1p)
R
θJMA
64 TBD 38 38 37 NA °C/W
100 TBD 35 35 34 NA °C/W
144 TBD NA NA 37 31 °C/W
176 TBD NA NA NA 30 °C/W
Thermal resistance, Junction to Ambient
(@200 ft/min)
1, 3
Four layer board
(2s2p)
R
θJMA
64 TBD 36 36 35 NA °C/W
100 TBD 34 34 33 NA °C/W
144 TBD NA NA 36 30 °C/W
176 TBD NA NA NA 29 °C/W
Thermal resistance, Junction to Board
4
— R
θJB
64 TBD 25 25 23 NA °C/W
100 TBD 25 25 24 NA °C/W
144 TBD NA NA 30 24 °C/W
176 TBD NA NA NA 24 °C/W
Table continues on the next page...
Thermal attributes
S32K1xx Data Sheet, Rev. 4, 06/2017
NXP Semiconductors
Preliminary
61