Datasheet

J12
J10
J11
Input data valid
Output data valid
TCLK
TDI/TMS
TDO
J14
TDO
J13
Figure 34. Test Access Port timing
Thermal attributes
7.1
Description
The tables in the following sections describe the thermal characteristics of the device.
NOTE
Junction temperature is a function of die size, on-chip power
dissipation, package thermal resistance, mounting side (board)
temperature, ambient temperature, air flow, power dissipation
or other components on the board, and board thermal resistance.
7.2
Thermal characteristics
7
Thermal attributes
S32K1xx Data Sheet, Rev. 4, 06/2017
60
Preliminary
NXP Semiconductors