Datasheet

4.3 Thermal operating characteristics
Table 3. Thermal operating characteristics for 64 LQFP, 100 LQFP, and 100 MAP-BGA
packages.
Symbol Parameter Value Unit
Min. Typ. Max.
T
A C-Grade Part
Ambient temperature under bias −40 — 85
1
℃
T
J C-Grade Part
Junction temperature under bias −40 — 105
1
℃
T
A V-Grade Part
Ambient temperature under bias −40 — 105
1
℃
T
J V-Grade Part
Junction temperature under bias −40 — 125
1
℃
T
A M-Grade Part
Ambient temperature under bias −40 — 125
2
℃
T
J M-Grade Part
Junction temperature under bias −40 — 135
2
℃
1. Values mentioned are measured at ≤ 112 MHz in HSRUN mode.
2. Values mentioned are measured at ≤ 80 MHz in RUN mode.
General
S32K1xx Data Sheet, Rev. 4, 06/2017
NXP Semiconductors
Preliminary
11