Datasheet

RB751_SER_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 21 May 2007 6 of 10
NXP Semiconductors
RB751 series
Schottky barrier single diodes
10. Soldering
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD882
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD523 (SC-79)
mbl872
1.30
0.30R = 0.05 (8×) R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
0.80
(2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
mgs343
1.80
1.90
0.30
0.40
0.50
1.20
0.60
2.15
solder lands
solder resist
occupied area
solder paste