Datasheet

PRTR5V0U4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 5 March 2012 6 of 10
NXP Semiconductors
PRTR5V0U4D
Ultra low capacitance quadruple rail-to-rail ESD protection
11. Soldering
Fig 4. Reflow soldering footprint SOT457 (SC-74)
Fig 5. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
sot457_fr
3.45
1.95
2.8253.3
0.45
(6×)
0.55
(6×)
0.7
(6×)
0.8
(6×)
2.4
0.95
0.95
Dimensions in mm
sot457_fw
5.3
5.05
1.45
(6×)
0.45
(2×)
1.5
(4×)
2.85
1.475
1.475
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm