Datasheet

PMEG6010ER_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 9 March 2010 10 of 14
NXP Semiconductors
PMEG6010ER
1 A low V
F
MEGA Schottky barrier rectifier
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000
PMEG6010ER SOD123W 4 mm pitch, 12 mm tape and reel -115
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOD123W
2.9
2.8
4.4
1.62.1
1.2
(2×)
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
1.1
(2×)
1.2
(2×)
sod123w_
fr
Dimensions in mm